Precision technology that leads the global semiconductor market
Facility Solution
Dry Type
Removes hazardous gases using solid adsorbents through physical/chemical mechanisms
Generates minimal particulate by-products, reducing chamber contamination
Low power consumption and cost-effective maintenance
Plasma Type
Decomposes and neutralizes gases using plasma treatment
Provides high-efficiency reactions for hard-to-decompose gases
Stable long-term operation even in high-temperature plasma environments
Wet Type
Cleanses water-soluble hazardous gases using liquid absorbents
Suitable for high-volume processing and easy to maintain
Enables safe, moisture-based treatment during equipment exhaust