Products

Precision technology that leads the
global semiconductor market

Facility Solution

  • 3

    Dry Type

    Removes hazardous gases using solid adsorbents through physical/chemical mechanisms

    Generates minimal particulate by-products, reducing chamber contamination

    Low power consumption and cost-effective maintenance

  • 2

    Plasma Type

    Decomposes and neutralizes gases using plasma treatment

    Provides high-efficiency reactions for hard-to-decompose gases

    Stable long-term operation even in high-temperature plasma environments

  • 1

    Wet Type

    Cleanses water-soluble hazardous gases using liquid absorbents

    Suitable for high-volume processing and easy to maintain

    Enables safe, moisture-based treatment during equipment exhaust

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