Precision technology that leads the global semiconductor market
Consumable Parts
Insert Ring
Fixes the wafer edge to prevent slight positional shifts
Enhances etching uniformity and minimizes edge damage
Maintains shape stability during repeated processes to ensure high yield
Showerhead
Evenly disperses reactive gases through multiple micro-holes
Maintains plasma uniformity and controls electron density distribution
Excellent resistance to temperature and electrical property changes, ensuring stable processing
Ground Ring
Controls plasma boundary to minimize center-to-edge etching deviation
Ensures stable electrical connection with RF ground to improve process repeatability
Outstanding plasma resistance enables long-term usage
Edge Ring
Protects the wafer edge to prevent plasma concentration
Maintains excellent corrosion resistance in high-temperature, high-intensity plasma environments
Reduces edge particle generation and prevents wafer breakage during processing
Offers outstanding chemical stability and durability against corrosive gases
Precisely controls high-energy plasma distribution
Supports optimized gas flow and thermal distribution for advanced microfabrication
Boat
Used to support wafers during semiconductor thermal processing
Maintains dimensional accuracy without warping under high temperatures and rapid thermal changes
Minimizes particle generation, meeting strict cleanroom standards
Socket
Precisely positions and secures wafers on the electrostatic chuck (ESC)
Prevents wafer movement or vibration during processing to enhance pattern accuracy
Supports electrical contact or alignment between wafer and equipment
Gasket
Provides vacuum sealing to block external gas inflow into the chamber
Offers cushioning and sealing against mechanical vibrations
Maintains excellent resilience and sealing reliability even after repeated assembly
Gel
High-elasticity material that maintains sealing performance in high-temperature and high-vacuum environments
Minimizes deformation during plasma processes and ensures long-term stability
Distributes pressure evenly to prevent surface damage
EMI Gasket
Provides electromagnetic shielding to minimize interference between devices
Prevents poor electrical contact and enhances system stability
Effective in suppressing noise in RF systems and communication modules
Ring
Maintains heat resistance and insulation during high-temperature and plasma processes
Transparent characteristics enable optical monitoring during processing
Anti-static function minimizes particle generation
Excellent gas diffusion uniformity and chemical stability due to quartz properties
Non-metallic electrode prevents ion contamination in specific processes
Enables fine gas control in CVD and Dry Etch processes
Maintains precise wafer alignment during high-temperature thermal processes
Optimized heat-resistant glass properties for oxidation and diffusion processes
Maintains shape and suppresses particle generation even under prolonged high temperatures
Tube
Ensures a stable processing environment inside thermal and gas reaction furnaces
Neutral to gas reactions, minimizing process contamination
Low thermal expansion rate supports process repeatability