Precision technology that leads the global semiconductor market
Facility Solution
APC Valve
Precisely controls process chamber pressure in real time
Feedback-based automatic control improves process accuracy
High-speed response enables fine vacuum stage transitions
Gate Valve
Mechanically isolates vacuum zones inside and outside the chamber
Durable materials ensure long life for repeated operations
Designed to minimize leakage in high vacuum conditions
Slit Valve
Maintains vacuum and enables automatic opening/closing during wafer loading
Particle-suppressing structure ideal for high-cleanliness process lines
Corrosion-resistant coating compatible with various process gases
Dry Type
Removes hazardous gases using solid adsorbents through physical/chemical mechanisms
Generates minimal particulate by-products, reducing chamber contamination
Low power consumption and cost-effective maintenance
Plasma Type
Decomposes and neutralizes gases using plasma treatment
Provides high-efficiency reactions for hard-to-decompose gases
Stable long-term operation even in high-temperature plasma environments
Wet Type
Cleanses water-soluble hazardous gases using liquid absorbents
Suitable for high-volume processing and easy to maintain
Enables safe, moisture-based treatment during equipment exhaust
Dry Pump
Oil-free design minimizes contamination risk
Enables precise vacuum control and variable pressure operation
Corrosion-resistant coating ensures long service life
Turbo Pump
Achieves high vacuum using high-speed rotating blades
Maintains stable vacuum in molecular flow regimes
Low vibration and noise, ideal for equipment integration
Pump Repair
Provides precision diagnosis and replacement of internal pump components
Rebalancing and re-lubrication to restore performance and extend lifespan
Ensures process reliability by restoring to original specifications