Precision technology that leads the global semiconductor market
Consumable Parts
Insert Ring
Fixes the wafer edge to prevent slight positional shifts
Enhances etching uniformity and minimizes edge damage
Maintains shape stability during repeated processes to ensure high yield
Showerhead
Evenly disperses reactive gases through multiple micro-holes
Maintains plasma uniformity and controls electron density distribution
Excellent resistance to temperature and electrical property changes, ensuring stable processing
Ground Ring
Controls plasma boundary to minimize center-to-edge etching deviation
Ensures stable electrical connection with RF ground to improve process repeatability
Outstanding plasma resistance enables long-term usage